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Hangzhou Freqcontrol Electronic Technology Ltd. We Grow Crystal. We Fabricate Wafer. We are Piezoelectric Specialist.
4 Years
| Ask Lasest Price | |
| Brand Name : | CSIMC |
| Model Number : | Fused Silica, Fused Quartz |
| Certification : | ISO:9001, ISO:14001 |
| Price : | Negotiable |
| Payment Terms : | T/T |
| Supply Ability : | 20000 pcs/Month |
| Delivery Time : | 1-4 weeks |
Our Fused Quartz Wafer is designed with precision and accuracy to meet the standards required by the semiconductor industry. It comes with a primary flat surface available in 22mm, 32.5mm, 42.5mm, 57.5mm/notch, notch, or notch, depending on your preferences. This ensures that the wafer is stable and leveled during the manufacturing process, providing consistent results.
Our Silica Glass Wafer offers high transmission for both ultraviolet and visible light, making it perfect for various applications such as microelectronics, optics, and photonics. The wafer is polished to perfection, with a polished side Ra of less than 1.0nm or specific per requested, ensuring that there are no defects or scratches on the surface that could affect the performance of the wafer.
Our SiO2 Wafer has a low warp, which ensures that it remains flat and stable throughout the manufacturing process. The wafer comes in different warp options, including less than 30µm, less than 40µm, less than 50µm, less than 50µm, less than 60µm, and less than 60µm, giving you the flexibility to choose the best option for your specific application.
Our Fused Silica Wafer is a reliable and high-performance product that guarantees exceptional results. It is an ideal choice for various applications in the semiconductor industry, including microelectronics, optics, and photonics. Order now and experience the performance and quality that our SiO2 Wafer provides.
Keywords: Quartz Wafer, Fused Silica Wafer, Silica Glass Wafer
| Product Name | Technical Parameters |
|---|---|
| JGS1 JGS2 JGS3 Glass and Quartz wafer for Superior Optical Clarity Chemical Stability | Surface: DSP |
| Thickness: 350um | |
| Warp: <30µm | |
| Type: Fused Silica | |
| Transmission: Ultraviolet And Visible | |
| PLTV(<0.5um): ≥95%(5mm*5mm) | |
| JGS1 JGS2 JGS3 Glass and Quartz wafer for Superior Optical Clarity Chemical Stability | Surface: SSP |
| Thickness: 500um | |
| Warp: <40µm | |
| Type: Fused Silica | |
| Transmission: Ultraviolet And Visible | |
| LTV (5mmx5mm): <2µm | |
| JGS1 JGS2 JGS3 Glass and Quartz wafer for Superior Optical Clarity Chemical Stability | Surface: DSL |
| Thickness: 1000um | |
| Warp: <50µm | |
| Type: Fused Silica | |
| Transmission: Ultraviolet And Visible | |
| Bow: ±20µm | |
| Fused Silica Wafer | Surface: DSP |
| Thickness: 350um | |
| Warp: <50µm | |
| Type: Fused Quartz | |
| Transmission: Ultraviolet And Visible | |
| Bow: ±25µm | |
| Fused Silica Wafer | Surface: SSP |
| Thickness: 500um | |
| Warp: <60µm | |
| Type: Fused Quartz | |
| Transmission: Ultraviolet And Visible | |
| Bow: ±40µm | |
| Fused Silica Wafer | Surface: DSL |
| Thickness: 1000um | |
| Warp: <60µm | |
| Type: Fused Quartz | |
| Transmission: Ultraviolet And Visible | |
| Bow: ±60µm |
The Fused Silica Wafer is available in different diameters, including 50.8mm, 76.2mm, 100mm, 150mm, and 200mm. The primary flat of the wafer is available in 22mm, 32.5mm, 42.5mm, 57.5mm/notch, notch, notch. The surface of the wafer is available in DSP, SSP, and DSL. The wafer package comes in cassette/jar packaging, vacuum-sealed to ensure its safety during delivery.
The Fused Silica Wafer from BonTek has been certified under ISO:9001 and ISO:14001, which ensures that the product meets all the quality standards and is environmentally friendly. The product is manufactured in China, and the minimum order quantity is 5 pcs.
The Fused Silica Wafer is an ideal product for different application occasions and scenarios. It is widely used in the semiconductor industry, where it is used to fabricate complex integrated circuits and microchips. The wafer is also used in the optical industry for making precision lenses and optical components. The wafer's high thermal stability and excellent thermal shock resistance make it ideal for use in high-temperature applications.
The Fused Silica Wafer is a versatile product that can be used in different scenarios. It is an excellent material for making microelectromechanical systems (MEMS), where it is used to fabricate microsensors and microactuators. The wafer is also used in the aerospace industry, where it is used to make high-temperature resistant components that can withstand extreme environments. The wafer is also used in the biomedical industry, where it is used to make biochips and other medical devices.
Whether you are in the semiconductor industry, the optical industry, the aerospace industry, or the biomedical industry, the Fused Silica Wafer from BonTek is an ideal product for your needs. With a supply ability of 20000 pcs/month, we can meet your demand and deliver the product within 1-4 weeks. The price of the product is negotiable, and the payment terms are T/T.
Our Fused Silica Wafers are of the highest quality and are extensively used in a variety of applications such as semiconductor manufacturing, MEMS, and optics. We offer technical support and services to ensure that our products meet your requirements. Our services include:
Our technical team is always available to assist you with any questions or concerns you may have regarding our Fused Silica Wafer products.
Product Name: Fused Silica Wafer
Product Description: High purity, high temperature resistance, and excellent optical properties make fused silica wafers perfect for semiconductor and optic applications.
Packaging: Fused silica wafers are carefully packaged in a cleanroom environment to prevent any contamination. Each wafer is individually wrapped in anti-static material and placed in a protective container.
Shipping: We offer worldwide shipping for our fused silica wafers. They are shipped via a secure courier service to ensure safe and timely delivery. Delivery times may vary depending on the destination.
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