| Sign In | Join Free | My himfr.com |
|
Hangzhou Freqcontrol Electronic Technology Ltd. We Grow Crystal. We Fabricate Wafer. We are Piezoelectric Specialist.
4 Years
| Ask Lasest Price | |
| Brand Name : | BonTek |
| Model Number : | SAP |
| Certification : | ISO:9001 |
| Price : | $80.00/ea |
| Delivery Time : | 2~4 weeks |
| Payment Terms : | TT/in advance |
| Supply Ability : | 10000 pcs |
Superior Quality Sapphire Wafer ≤3μm TTV Roundness Edge Grinding
Sapphire Wafer is an advanced substrate made of sapphire material. It has great parallelism of ≤3 Arc Sec, TTV of ≤3μm, thickness of 0.5mm-3mm and roundness of edge grinding. With its high-end material and strict quality control, Sapphire Wafer provides you with maximum reliability and stability in your application.
Sapphire Wafer can be used in a variety of applications, such as optoelectronic device, laser device, semiconductor device, etc. It features great parallelism, excellent surface flatness, perfect edge grinding and superior material. With its reliable performance and high precision, Sapphire Wafer is the ideal solution for your application.
Sapphire Wafer is the perfect choice for your application. With its excellent performance, reliable material and strict quality control, you can be sure that Sapphire Wafer can provide you with the best results. With its superior parallelism, TTV, thickness and edge grinding, Sapphire Wafer is the perfect choice for your application.
| Sapphire Wafer | |||
| Item | 2 Inch | 4 Inch | 6 Inch |
| Crystal | LED Grade Sapphire | LED Grade Sapphire | LED Grade Sapphire |
| Purity | >99.998% | >99.998% | >99.998% |
| Color | Transparent | Transparent | Transparent |
| Orientation | C plane tiled M axis 0.20°±0.1° | C plane tiled M axis 0.20°±0.1° | C plane tiled M axis 0.20°±0.1° |
| Diameter | 50.8±0.1mm | 100±0.2mm | 150±0.2mm |
| Thickness | 430±15um | 650±25um | 1300±25um |
PF Location | A-axist±0.2° | A-axist±0.2° | A-axist±0.2° |
Flat Length | 16.0±1.0mm | 30.0±1.0mm | 49.0±1.0mm |
Front Side Surface | Mirror polished EPI-Ready | Mirror polished EPI-Ready | Mirror polished EPI-Ready |
Surface Roughness | Ra<3A | Ra<3A | Ra<3A |
Back Side Roughness | Fine ground, Ra=1.0±0.2um | Fine ground, Ra=1.0±0.2um | Fine ground, Ra=1.0±0.2um |
| TTV | <5.0um | <10um | <15um |
| BOW | 0~-5um | 0~-10um | 0~-30um |
| Warp | <10um | <15um | <40um |
Bubble& Color | None by visual inspection in fluorescent light | ||
| Cleanliness | Free visible contamination | ||
| Packaging | Vacuum packed in one-piece box or Entegris cassettes of 25 | ||
BonTek brand Sapphire Plate and Sapphire Substrate with SAP model number offer high flatness, high orientation, high perpendicularity, and high surface roughness. With ISO:9001 certification and competitive price of $60.00/ea, it's minimum order quantity is 10 pcs. Packaging Details are Cassette, vacuum sealed; Delivery Time is 2~4 weeks; Payment Terms is TT/in advance; and Supply Ability is 10000 pcs. Material is Sapphire and it's Flatness is λ/10; Orientation is ±0.5°; Perpendicularity is ≤3 Arc Min; Surface Roughness is Ra<0.2nm.
BonTek's SAP model Sapphire Wafer is a high quality product that has been certified with ISO:9001. It has a minimum order quantity of 10 pcs, and each one is priced at $60.00. Packaged with a cassette and vacuum sealed, the delivery time is 2~4 weeks and payment terms are TT/in advance. With a supply ability of 10000 pcs, the clear aperture is greater than 90%, parallelism is ≤3 Arc Sec, Bow & Warp is ≤20μm, and thickness is 0.5mm-3mm.
To ensure the safe delivery of the Sapphire Wafer to its destination, we have established a standard packaging and shipping process.
Sapphire Wafer will be packaged in a box that is lined with foam to protect it from any damage caused by impacts during shipping. The box size is determined by the size and weight of the Sapphire Wafer.
Sapphire Wafer will be shipped using a reputable shipping company that has a track record of delivering packages safely and on time. We will insure the package to cover any loss or damage.
|
|
