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Hangzhou Freqcontrol Electronic Technology Ltd. We Grow Crystal. We Fabricate Wafer. We are Piezoelectric Specialist.
4 Years
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| Brand Name : | BonTek |
| Model Number : | Glass substrates |
| Certification : | ISO:9001 |
| Delivery Time : | 2 weeks |
| Payment Terms : | TT/in advance |
| Supply Ability : | 100000/month |
Fused Silica Wafer is a high-performance, cost-effective IC Silicon Wafer product that is widely used in the semiconductor, MEMS and medical industries. It is made from high-purity fused quartz, and it is a high-end material for the production of electronic products and components. Its unique properties make it ideal for many applications, including optical elements, optical lenses, and other optical components. The surface of the Fused Silica Wafer is extremely smooth and it is highly resistant to wear and tear. It has excellent optical transmission properties and high reflectance of less than 0.25%. Besides, it also has excellent thermal shock resistance and excellent thermal conductivity. The Fused Silica Wafer has a surface quality of 20-10. It is certified by ISO9001 and RoHS. It is also suitable for a wide range of applications such as Calcium Silicate Board, Fused Quartz Labware and other components used in electronic devices.
The Fused Silica Wafer is available in different coatings including AR, HR, and V-Coat, giving it a wide range of applications. It has excellent mechanical properties, making it an ideal choice for a variety of applications. It has a high level of durability and low maintenance requirements, making it a cost-effective choice for semiconductor, MEMS and medical industry applications. The Fused Silica Wafer also provides excellent thermal stability, making it suitable for long-term use in a variety of environments.
| Material | UV Fused Silica, Fused Quartz (JGS1, JGS2, JGS3) | ||||||
| Specification | unit | 3” | 4” | 5" | 6" | 8" | 12" |
| Diameter (or Square) | mm | 76.2 | 100 | 125 | 150 | 200 | 300 |
| Tol(±) | mm | <0.1~0.25 mm | |||||
| Thinnest Thickness | mm | >0.10 | >0.10 | >0.30 | >0.30 | >0.30 | >0.50 |
| Primary Flat | mm | 22 | 32.5 | 42.5 | 57.5/notch | notch | notch |
| LTV (5mmx5mm) | µm | <2 | <2 | <2 | <2 | <2 | <10 |
| TTV | µm | <8 | <10 | <15 | <20 | <30 | <30 |
| Bow | µm | ±20 | ±25 | ±40 | ±40 | ±60 | ±60 |
| Warp | µm | <30 | <40 | <50 | <50 | <60 | <60 |
| PLTV(<0.5um) | % | ≥95%(5mm*5mm) | |||||
| Transmittance | UV, Optical, IR or Custom option | ||||||
| Edge Rounding | mm | Compliant with SEMI M1.2 Standard/refer to IEC62276 | |||||
| Surface Type | Single Side Polished /Double Sides Polished | ||||||
| Polished side Ra | nm | <1.0nm or specific per requested | |||||
| Back Side Criteria | µm | General is 0.2-0.5µm or as customized | |||||
| Appearance | Contamination | None | |||||
| Particles>0.3µm | <=30 | ||||||
| Saw Marks, striations | None | ||||||
| Scratch | None | ||||||
| Cracks, saw marks, stains | None | ||||||
| Parameter | Value |
|---|---|
| Material | High Purity Fused Silica/Glass Wafer |
| FLH Model | JGS1, JGS2, JGS3, F-HUV |
| OHARA Model | SK1300, SK1310 |
| Schott Model | Borofloat 33, B270, D263, Zerodur, MEMpax, BK7 |
| Thickness | 0.1-10mm |
| Damage Threshold | >10J/cm2 |
| Metal Impurities | <0.2ppm |
| Diameter | 2-12 Inch |
| Transmission | IR, Visible, DUV |
| Inspection Report | Per Request |
| Second Flat | Per Request |
BonTek offers a wide range of high purity fused silica wafers with various models such as Corning C7980, C7979, Eagle XG, Gorilla, FLH JGS1, JGS2, JGS3 and F-HUV. The wafers are produced from fused quartz, borosilicate glass, optical glass, quartz glass and other materials with excellent optical properties.
Our fused silica wafers are certified with ISO9001 and can be used in a wide range of applications such as IR, visible and DUV transmission. With minimum order quantity of 5 pieces and delivery time of 2 weeks, BonTek's fused silica wafers are reliable and cost-effective. We guarantee a high level of quality and supply ability of 100000/month.
Our fused silica wafers feature a very precise surface roughness of Ra<1.0nm, making them perfect for a variety of applications. The wafers come in various brands such as Corning, Schott, OHARA, FLH and China Glass. We offer wafers with various types of packaging such as cassette and jar.
BonTek offers customized Fused Silica Wafers with a model number of Glass Substrates. Our Fused Silica Wafers are ISO:9001 certified, with a minimum order quantity of 5 pcs. Each wafer is packaged in either a cassette or jar, and we guarantee a two-week delivery. Our payment terms are TT/in advance, and we are capable of supplying up to 100000 wafers per month. Our transmission range is 0.17-2.1um, 0.26-2.1um, and 0.185-3.5um, with a damage threshold of >10J/cm2, TTV of <2um, <5um, and BOW of <30um. Our Fused Silica Wafers are made of High Purity Fused Silica and Borosilicate Glass, and are ideally used for Calcium Silicate Board manufacturing.
We provide technical support and services for Fused Silica Wafers. Our technical team is available to answer any questions about our products, provide advice on product selection, and help troubleshoot any issues that may arise during the manufacturing process. We also offer customized services such as process optimization, product qualification, and metrology solutions to meet your specific needs. We also provide training on the use of our products to ensure optimal performance.
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